- Qualcomm shows a Snapdragon Mini PC in the form of a dish at its 2025 summit
- Snapdragon X2 Reference Desktop Concept Ultra Delgada Cooling with Airjet modules
- If you will see daylight is uncertain, but the concept shows potential
In his recent Snapdragon Summit 2025, Qualcomm surprised attendees with two new reference desks driven by their next Snapdragon X2 Elite chips.
Among them, the most unusual design was a flat and circular computer that could easily be confused with a warmer or wireless cup wireless charger, according to PCMAGJohn Burek, who photographed the device.
The ultra thin mini pc has less than half an inch thick and a little larger than a tea cups.
Cooling
Beside him, he sits a handful of USB-C ports and a headphones connector, with a ring of ventes under which Burek points out reminds Mac Mini.
The machine on the screen was connected to a full-size screen on USB-C while Snapdragon Silicon was run in real time.
Cooling such a thin device is an obvious challenge, and Qualcomm turned to Airjet’s technology Frore Systems for this.
Instead of trusting fans, airjet modules use thermoelectric materials that press the air through the heat dissipator in silence.
Without moving parts, cooling prevents mechanical wear and noise, while allowing much more thin designs.
Qualcomm pointed out that Airjet is an option that is currently being explored, with traditional fans or totally without fans also possible depending on the performance objectives.
The Shipping PC appeared together with another desktop in a modular one, which illustrates Qualcomm’s interest in exploring factors beyond laptops and tablets.
Burek reported that Qualcomm is working with three OEM -based in Taiwan in reference models, which increases the possibility that some of the designs can reach the market.
Looking at the dish -shaped computer photos brought the V3 Mini PC vocation to mind that we reviewed in 2016.
That device measured with less than 10 mm thick and weighed less than 200 g. It was based on a cherry atom chip with low power, but the thermal emits limited yield due to the lack of a fan or heat -dissipated chassis.
Compared to that machine, Qualcomm’s reference desktop is so surprisingly thin, but promises significantly higher performance thanks to its most powerful arm -based chips and modern cooling.
The new concept shows how Snapdragon hardware could expand to new categories, and although this saucer design never beyond the prototype stage, I will certainly be in charge of the tail if it ever does.
