- Intel expands its liquid cooling technology to admit the future Nvidia’s chips
- Superfluid cooling addresses 1.5kw heat loads for high performance systems
- Taiwan associations position Intel as cooling leader for next generation chips
It is no secret that Intel, who recently appointed Lip-Bu as his new CEO, faces difficult times.
According to reports, the iconic chips manufacturer is considering turning its foundry division to a joint company with TSMC in an attempt to change things, but separated from those plans, Intel is also looking to change their fortunes by becoming an important player when cooling next -generation’s hardware.
According to the reports, the company’s superfluid cooling solution is able to manage heat output of up to 1.5KW per chip, a level of performance that could be essential to cool the NVIDIA GB300 superchip and also for the next rashing servers, such as those shown in GTC 2025.
Burbujas
In his event, Nvidia announced Kyber headquarters with Rubin Ultra Gpu.
According to the co -founder, president and CEO of Nvidia, Jensen Huang, these systems could attract up to 600kw, with future racks that can reach energy demands at the Megavatio level. As energy requirements grow, advanced cooling solutions such as Intel superfluous technology will become increasingly essential.
Intel first introduced superfluous cooling in 2023 and uses microbubble injection to improve refrigerant flow and heat transfer efficiency.
Mashdigi It reports that technology is inspired by a method used by the heavy industries of Mitsubishi, “where bubbles are generated under the ocean ships helmet to reduce water resistance and improve propulsion efficiency.”
The site continues to explain that in the case of superfluous cooling, “a similar approach is applied generating bubbles in the refrigerant to increase the flow rate and improve heat elimination. This is combined with cold plate designs to further improve thermal conductivity.
In addition, the system uses a new type of non -conductive dielectric fluid to avoid damage to submerged servers in case of a leak. ”This approach makes it very suitable for dense computer environments where traditional cooling methods fall short.
Intel recently exhibited his progress in the Advanced cooling technology forum of Superfluid 2025 in Taiwan, organized with the Institute for Industrial Technology Research.
According United Daily News Network (UDN)The event attracted more than 500 attendees and more than ten local suppliers, highlighting a strong interest of the industry. Taiwanese companies, including Maico, Yuanshan, Kuenling and Sun Max Tech, presented hardware built to admit the Intel cooling system, including server racks, chassis refrigerated by liquids and thermal components.
According to reports, Intel is also investing in advanced materials to reduce corrosion and mechanical wear, including metal -based liquid designs and electromagnetic pump systems, in order to improve long -term durability and reduce maintenance for large -scale implementations.
