- 2mm thick mSSD achieves write speeds of 6500 MB/s despite its size
- Longsys eliminates nearly 1,000 solder joints using wafer-level integration technology
- microSSD reduces defect rates from 1000 DPPM to just 100
Longsys has introduced what it calls the industry’s first integrated package microSSD or mSSD, using a design that merges several key components into a single compact package.
The mSSD measures just 20 x 30mm, is just 2mm thick and weighs just 2.2 grams.
Despite its size, it supports PCIe Gen4x4 performance, achieving sequential read speeds of up to 7400 MB/s and write speeds of up to 6500 MB/s.
Integrated chip packaging
This device achieves random read and write figures of up to 1000K and 820K IOPS, respectively, keeping performance in line with larger M.2 drives.
Unlike traditional SSDs that rely on PCB assembly, the mSSD uses wafer-level System-in-Package (SiP) technology.
This approach integrates the controller, NAND flash memory, power management IC, and other passive components within a single enclosure.
This eliminates nearly 1000 solder joints typically found in PCB-based SSDs.
Longsys says (originally in Chinese), this change improves overall reliability by reducing the defect rate from less than or equal to 1000 defective parts per million to less than or equal to 100.
The move also eliminates several manufacturing steps, such as PCB placement and reflow soldering, reducing complexity and the risk of solder mask contamination or heat damage.
With this system, Longsys says it can now complete manufacturing from wafer to finished product in a single process.
The company claims this doubles delivery efficiency while reducing additional production costs by more than 10%.
The design is also said to reduce energy consumption by eliminating the high-energy surface mounting process, which can help control carbon emissions and support environmental compliance.
For thermal performance, Longsys uses a combination of aluminum alloy mounts, graphene patches, and thermally conductive silicone to help dissipate heat.
It meets NVMe power standards, with idle power less than 3.5 milliwatts and maximum usage within specification limits.
The Longsys mSSD supports TLC and QLC NAND with capacities from 512GB to 4TB.
It also includes a clip-on modular heatsink that can expand the form factor to M.2 2230, 2242, or 2280 standards without tools.
This makes it adaptable to a wide range of devices, such as business laptops, portable consoles, drones and virtual reality headsets.
The mSSD is currently in the acceleration phase of mass production, with patents filed both nationally and internationally.
While its small size and integrated design may appeal to manufacturers, its advanced packaging process could make it more expensive than traditional portable SSDs at launch.
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