- Socamm is a new exclusive modular memory form factor of Nvidia Systems
- Micron says that Socamm offers high bandwidth, low power and a smaller footprint
- SK Hynix plans the production of Socamm as the demand for the infrastructure of AI grows
In the recent NVIDIA GTC 2025, Micron and SK Hynix memory manufacturers removed the wraps of their respective Socamm solutions.
This new modular memory factor is designed to unlock the entire potential of AI platforms and has been developed exclusively for the Nvidia Grace Blackwell platform.
Socamm, or attached memory module of small contour compression, is based on LPDDR5X and is intended to address the growing demands for performance and efficiency on AI servers. According to reports, the form factor offers a larger bandwidth, lower energy consumption and a smaller footprint compared to traditional memory modules such as RDIMM and MRDIMM. Socamm is specific to Nvidia’s architecture and, therefore, cannot be used in AMD or Intel systems.
More profitable
Micron announced that it will be the first to send Socamm products in volume and its 128 GB socmm modules are designed for NVIDIA GB300 Grace Blackwell Ultra Superchip.
According to the company, the modules deliver more than 2.5 times the bandwidth of the RDIMM while using a third of the power.
The compact 14×90 mm design is intended to admit efficient server and thermal administration designs.
“IA is promoting a paradigm shift in computing, and memory is in the heart of this evolution,” said Raj Narasimhan, senior vice president and general manager of the Computer Business Unit and Micron Networks.
“Micron’s contributions to the Nvidia Grace Blackwell platform produce energy saving performance and benefits for training and inference applications of AI.”
SK Hynix also presented its own low -power socmm solution in GTC 2025 as part of a broader AI memory portfolio.
Unlike Micron, the company did not enter too many details about it, but said it is positioning Socamm as a key offer for the future AI infrastructure and plans to start mass production “in line with the appearance of the market.”
“We are proud to present our line of leading products in the industry in GTC 2025,” said SK Hynix president and Chief of AI Infra Juseon (Justin) Kim.
“With a differentiated competitiveness in the AI memory space, we are on the way to bringing our future as the full -fashioned memory supplier.”
